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(주)유니오텍의 소식과 업계 동향을 확인할 수 있습니다.

DEEP CLEAVE GLASS CUTTING

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작성자 admin 조회 11,649회 작성일 19-05-17 14:23

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Elongated Focus with uniform intensity

 Our  DeepCleave module focuses an incident single mode laser into  a  tight spot with  ~ 1.8 um waist size along the  entire Depth of Focus range (1-2mm typical range) .

The focused spot is equivalent to 0.35 objective NA and is ideally suited for glass cutting of thick glasses, such as flat panels. 

This module is a complete optical solution for cutting applications. No need  for additional high NA objectives or other high cost  optics. 

The DeepCleave module differs from standard EF elements by constant peak power along the focus region and requires  low M^2 and accurate  input beam size.

Contact us for a quote

Why choose DeepCleave for your glass cutting application:

  • Full depth glass cut from single pulse
  • Complete solution in a single module
  • Very low aberrations level- spot diameter <2um
  • Easy to integrate into existing opto-mechanics. 

Intensity along Depth Of Focus - Standard EF (Zemax)
Intensity along Depth Of Focus - DeepCleave (Zemax)
Physical Optics Simulation of DeepCleave
Intensity profile along Z axis for DeepCleave

Specifications of DeepCleave Module ZT-001-J

Wavelengths1030nm, 1064nm, others by request
Required laser inputSingle mode M2<1.3
Input Beam Diameter (exp^-2)6mm (+-10% )
Depth of Focus in Air~1mm
Waist Diameter (exp^-2)1.8um
Working Distance3mm
Dimensions41mm diameter x104 mm length
Optical elements MaterialFused Silica
Efficency>93%
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